MS-TM Series Thermal Conductive Pads

MS-TM Series Thermal Conductive Pads

MS-TM series thermal conductive pads are used in the gaps between heating devices and heat sinks, metal bases, or equipment shells. Their softness, high resilience, and high compressibility make them well suited for filling the gap between the heat source and the heat sink, so that heat can be effectively conducted through the thermal conductive pad filling material to the entire heat sink, or from the PCB to the shell, frame, diffuser, or air. They provide heat conduction and shock absorption, improving the efficiency and service life of heating electronic components.

DESON Thermal Conductive Pads

The thermal conductivity of DESON thermal conductive pads can range from 1.0 W/mK to 16 W/mK. Depending on the different heat dissipation requirements of the material, hardness can be manufactured from 5 Shore 00 to 60 Shore 00. These pads can meet the requirements of most customer applications, and special-use designs can be made for customers.

Applications

Thermal conductive pads are widely used in microprocessors and high-speed buffer memory chips; computers; mobile phones and other portable electronic equipment; servers; the network communication industry; audio equipment; TVs; electric wind-blowing appliances and other daily smart home appliances; automatic control equipment; the lighting application industry and new energy vehicles.

F&A

  1. What are thermally conductive interface pad materials?

Thermal interface materials include various thermally conductive interface pads used between the heat source and the heat sink. By removing the air between the heat source and the radiator, they are materials that improve the heat distribution of electronic equipment and improve heat dissipation efficiency. Generally, various thermally conductive interface materials need to have good thermal conductivity and surface wettability.

  2. Will thermally conductive interface materials cause a short circuit between electronic components?

Thermal conductive pads are made of insulating material. Their withstand voltage is more than several thousand volts, and they will not cause electronic components to short-circuit.

  3. Can the size of thermally conductive interface materials be customized?

In addition to standard size specifications, thermal interface pad materials accept customer die-cut customization.

  4. What is the difference between non-silicone thermal material and a silicone thermal pad?

Non-silicone thermal pad material is a type of thermal conductive material that does not contain siloxane components. It can ensure that there will be no volatilization or contamination of silicone molecules during use. A silicone thermal pad is based on silicone gel, with various auxiliary materials such as metal oxides added. It is a heat-conducting medium material synthesized through a special process. It is specially produced for design schemes that use a gap to transfer heat. It can fill the gap, open up the heat channel between the heating part and the heat dissipation part, and effectively improve heat transfer efficiency, while also providing insulation, shock absorption, sealing, etc. It can meet the design requirements of equipment miniaturization and ultra-thinness. It is highly manufacturable and usable, and has a wide range of thicknesses; it is an excellent thermally conductive filler material.

  5. How should thermally conductive interface materials be selected?

First, determine the type of thermal interface material according to the customer's application. Then choose a suitable thermal interface material according to the product's thermal conductivity, thickness, size, density, withstand voltage, temperature, and other parameters.

  6. What are the applications of thermal interface materials?

Communication equipment, network terminals, data transmission, LEDs, automobiles, electronics, consumer electronics, medical equipment, military, and aerospace.